Key Benefits of TESCAN Large Volume Workflow
Unmatched analytical capabilities
Harness the power of TESCAN's industry-proven Plasma FIB-SEM and versatile micromachining laser system for a wide array of microstructural diagnostic techniques.
Sample preparation on a cubic mm scale
Efficiently prepare large volume samples or deep cross sections, quickly and without Ga implantation.
Deep insights into challenging samples
Access deeply buried ROIs quickly and effortlessly, even in non-conductive hard materials, with the accelerated material removal rates of our laser and Plasma FIB combination.
Artifact-free
results
Obtain pristine cross sections for ultra-high-resolution imaging using a superior surface polishing technique for access to the finest details across the entire cross section.
Optimized
throughput
Minimize both time-to-sample and cost-per-sample with technologies specifically designed for large volume material removal.
User-friendly interface and workflows
Enhance productivity with our intuitive software, enabling seamless operation of both Plasma FIB-SEM and laser ablation systems.
Discover Large Volume Workflow.
Accelerate mm-scale Semiconductor Failure Analysis with TESCAN Large Volume Workflow
Take Advantage of Comprehensive Failure Analysis
Efficiently cross-section millimeter-scale package level samples (3D ICs, TSVs, solder balls, flip-chips, etc.) for in-depth failure analysis.
Prepare Samples for Advanced Applications
Prepare chunk samples for high-resolution micro-CT analysis, atom probe tomography, and tensile or compression testing.
Accommodate Free-Form Sample Geometry
Achieve micrometer-precision, free-form sample preparation for specific geometries: in-plane TEM investigations, H-bars for FIB cross-sectional analyses, or complex 3D-shaped samples.